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ICROS TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process.
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The TAIKO process is the name of a wafer back grinding process that uses a new grinding method developed by DISCO. This method is different to conventional back grinding.
Grinding and Polishing GRINDING removes saw marks and levels and cleans the specimen surface. Polishing removes the artifacts of grinding but very little stock.
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